Straight through silicon at 180

New technology for sawing silicon, ceramics and semi-finished products dry and more quickly than ever

HK Präzisionstechnik GmbH presents a new diamond wire saw incorporating revolutionary sawing technology. A thin continuous wire guided via return rollers saws the hardest abrasive materials at very high speed. The saw works in dry operation, without cooling water. This allows you to cut material such as silicon blocks both quickly and safely. Thanks to the new technology developed by HK; the rapidly guided thin wire makes only line contact in the material. This prevents heating, and produces less waste. And because only low clamping forces are required, it is also possible to work sensitive materials or material combinations.

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